AGFB023R24C2E2V

AGFB023R24C2E2V

Part number
AGFB023R24C2E2V
Product Categories
System On Chip (SoC)
Manufacturer
Intel
Describe
IC
Encapsulation
-
Package
Tray
ROHS status
No
Price
USD $19,621.0600
Data sheet
-
Quantity
RFQ
In stock:
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
3
$19,621.0600
$58,863.1800
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Purchase and inquiry
Specification
Transport
Data sheet
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA

Shipping fee


Shipping starts at $40, but can be over $40 for some countries. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
Basic shipping charges (package ≤0.5kg or corresponding volume) depend on time zone and country.


Mailing method


Currently, our products are shipped via DHL, FedEx, SF and UPS.


Delivery time


Once the goods are shipped, the estimated delivery time depends on the shipping method you choose:

FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

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