XCVM1502-1MLIVFVC1760

XCVM1502-1MLIVFVC1760

Part number
XCVM1502-1MLIVFVC1760
Product Categories
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Describe
IC VERSALPRIME ACAP FPGA 1760BGA
Encapsulation
-
Package
Tray
ROHS status
Yes
Price
USD $9,951.2500
Data sheet
Quantity
RFQ
In stock:
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$9,951.2500
$9,951.2500
Similar models
XCVM1502
AMD
ACAP
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Purchase and inquiry

Specification

Transport

Data sheet

ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.

TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O500
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA

Shipping fee


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Basic shipping charges (package ≤0.5kg or corresponding volume) depend on time zone and country.


Mailing method


Currently, our products are shipped via DHL, FedEx, SF and UPS.


Delivery time


Once the goods are shipped, the estimated delivery time depends on the shipping method you choose:

FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

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