XCVC1502-2LSENSVG1369

XCVC1502-2LSENSVG1369

Part number
XCVC1502-2LSENSVG1369
Product Categories
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Describe
IC VERSAL AI-CORE FPGA 1369BGA
Encapsulation
-
Package
Tray
ROHS status
Yes
Price
USD $20,802.5000
Data sheet
Quantity
RFQ
In stock:
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$20,802.5000
$20,802.5000
msg
msg
msg
msg
msg
msg
msg
msg
Purchase and inquiry
Specification
Transport
Data sheet
ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed450MHz, 1.08GHz
Number of I/O500
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 800k Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

Shipping fee


Shipping starts at $40, but can be over $40 for some countries. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
Basic shipping charges (package ≤0.5kg or corresponding volume) depend on time zone and country.


Mailing method


Currently, our products are shipped via DHL, FedEx, SF and UPS.


Delivery time


Once the goods are shipped, the estimated delivery time depends on the shipping method you choose:

FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

XCVC1502-2LSENSVG1369 Related Information
Hot selling parts
Related categories